Microneedles and methods of fabricating
US7785459B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 28, 2006 |
| Grant date | Aug 31, 2010 |
| Priority date | — |
| Expiry date | Jul 1, 2029 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D1/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Low cost methods for fabricating microneedles are disclosed. According to one embodiment, the fabrication method includes the steps of: providing a substrate; forming a metal-containing seed layer on the top surface of the substrate; forming a nonconductive pattern on a portion of the seed layer; plating a first metal on the seed layer and over the edge of the nonconductive pattern to create a micromold with an opening that exposes a portion of the nonconductive pattern; plating a second metal onto the micromold to form a microneedle in the opening; separating the micromold with the microneedle formed therein from the seed layer and the nonconductive pattern; and selectively etching the micromold so as to release the microneedle. In another embodiment, the micromold is not required. The method according to this embodiment includes: forming a recess with an apex in a substrate; forming a seed layer on the substrate; forming a nonconductive pattern on a portion of the seed layer that is on a sidewall surface of the recess; plating an electrically conductive material over the seed layer and over the edge of the nonconductive pattern to form a plated layer with an opening that exposes …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.