Solvent formulations for solution deposition of organic materials onto low surface energy layers
US7785489B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2006 |
| Grant date | Aug 31, 2010 |
| Priority date | — |
| Expiry date | Nov 16, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S428/917
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Compositions for improved liquid deposition of active material in manufacturing processes of electronic devices are provided. The compositions comprise at least one active material for liquid deposition, at least one first solvent, at least one second solvent, and at least one third solvent, with a fourth solvent optional. The solvents are selected on the basis of their co-miscibility, ability to form a composition with each other and with active material without significant precipitation of active material from the composition, and at least one of the solvents having a surface tension equal to or less than that of the substrate upon which active material is to be deposited.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.