Photosensitive resin composition
US7785765B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2006 |
| Grant date | Aug 31, 2010 |
| Priority date | — |
| Expiry date | Dec 1, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/106
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention relates to a photosensitive resin composition comprising at least a thermoplastic elastomer (a), a photopolymerizable unsaturated monomer (b), and a photopolymerization initiator (c), characterized in that the thermoplastic elastomer (a) comprises at least vinyl aromatic hydrocarbon units, butadiene units, and alkylene units and contains alkylene units not less than 5 wt % and not more than 80 wt % with respect to the total amount of butadiene units and alkylene units. The present invention provides a photosensitive resin composition that simultaneously achieves excellent fine line reproducibility, ester solvent resistance, and prevention of cracks occurring on plate surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.