Curable resin composition
US7786225B2 · kind B2 · utility
8Cited by
7References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2004 |
| Grant date | Aug 31, 2010 |
| Priority date | — |
| Expiry date | Dec 19, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A curable resin composition, which is a solid resin at ordinary temperatures obtained by reacting an epoxy resin with a (meth)acrylic anhydride, contains an unsaturated resin having a (meth)acryloyl group (A) which has a double bond equivalent weight of 200 to 500, an ester number of 100 to 300, and a hydroxyl number of no more than 130, an ethylenically unsaturated monomer (B), and a radical polymerization initiator (C).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.