Proximity optical memory module having an electrical-to-optical and optical-to-electrical converter
US7786427B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 6, 2008 |
| Grant date | Aug 31, 2010 |
| Priority date | — |
| Expiry date | Mar 10, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A memory module is formed of multiple memory chips and an optical interface chip fixed on a substrate. The chips are interconnected by proximity communication (PxC) in which each chip includes transmitting and receiving elements, such as electrical pads which form capacitively coupled links when the chips are placed together with their pads facing each other. The PxC links may be directly between the chips or through an intermediate passive bridge chip. The interface chip is coupled to an external optical channel and includes converters between optical and electrical signals, control circuitry, buffers, and PxC elements for communicating with the memory chips. The array of memories may be a linear or two-dimensional array around the interface chip forming a redundant PxC network, optionally with redundant PxC connections. Multiple rectangular memory chips may present their narrow sides to the interface chip to maximize bandwidth.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.