Semiconductor devices with multiple heat sinks
US7786555B2 · kind B2 · utility
5Cited by
13References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 20, 2005 |
| Grant date | Aug 31, 2010 |
| Priority date | — |
| Expiry date | May 31, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device that includes multiple heat sinks is provided along with methods for forming a semiconductor device having multiple heat sinks. The semiconductor device includes a first heat sink that is configured as a conductive lead frame. The conductive lead frame is electrically coupled to a conducting area of a semiconductor die. The semiconductor device also includes a second heat sink that is configured as a conductive clip. The conductive clip is electrically coupled to another conducting area of the die. Alternative embodiments of the device may include more than two heat sinks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.