Patent · US Active

Stacking multiple devices using single-piece interconnecting element

US7786563B1 · kind B1 · utility

3Cited by

0References

21Claims

0Family size

Assignee

Virtium Technology, Inc. · US

Inventors

Phan Hoang · Placentia, US
Chinh Nguyen · Irvine, US
Anthony Tran · Cumming, US
Tung Dang · Wiesloch, DE

Key dates

Filing date	Jun 28, 2007
Grant date	Aug 31, 2010
Priority date	—
Expiry date	May 10, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10674
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An embodiment of the present invention is a technique to stack multiple devices using an interconnecting element. A board has a periphery and top and bottom surfaces. The top surface has top contact pads to attach to a first device. The bottom surface is milled down to form a cavity confined by vertical walls around the periphery. The cavity fits a second device. Bottom contact pads are formed on bottom side of the vertical walls. The bottom contact pads are raised with respect to the bottom side of the vertical walls. Traces internal to the board connect the bottom contact pads to the top contact pads.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.