Patent · US Active

Probe card assembly and test probes therein

US7786744B2 · kind B2 · utility

0Cited by

34References

12Claims

0Family size

Assignee

KING YUAN ELECTRONICS CO, LTD. · TW

Inventors

Cheng Ni · Shanghai, CN
Kun-Chou Chen · Baoshan, TW

Key dates

Filing date	Dec 18, 2008
Grant date	Aug 31, 2010
Priority date	—
Expiry date	May 15, 2029

Classification

Technology area (CPC G)Physics
CPC primaryG01R1/07342
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

Discloses are a probe card assembly and test probes used therein. The probe card assembly includes a main body, a probe base disposed in a central portion of the main body and a plurality of test probes connected between the probe base and the main body. Each of the test probes has a tip extending from the probe base for contacting a wafer under test. The test probes include at least one power probe, at least one signal probe and a plurality of ground probes. Each of the test probes has a middle section interposed between the main body and the probe base. Each of the test probes except the ground probes has a naked middle section coated with an insulating film but not sheltered by an insulating sleeve.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.