Tamper respondent system
US7787256B2 · kind B2 · utility
1,262Cited by
14References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2007 |
| Grant date | Aug 31, 2010 |
| Priority date | — |
| Expiry date | Jan 12, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A tamper respondent system having: a physical volume containing an electronic device to be protected; an at least partially conductive surface proximate to the electronic device; and a tamper respondent sensor over the electronic device (the sensor comprising: a flexible, dielectric substrate; conductive traces on the substrate; a porous insulating layer having pores over the conductive traces; and adhesive within said pores of said porous insulating layer), wherein the adhesive is in contact with both the substrate and the at least partially conductive surface through the porous insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.