Process for producing substrate
US7788948B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 1, 2006 |
| Grant date | Sep 7, 2010 |
| Priority date | — |
| Expiry date | Jul 15, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0306
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
To provide a process for producing a reliable substrate in good yield, by suppressing bleeding of boric acid from a green sheet comprising a powder of borosilicate glass to improve printability of a conductive pattern thereby to prevent disconnection.A process for producing a substrate which comprises firing a green sheet comprising a powder of borosilicate glass, wherein the powder is one prepared by holding borosilicate glass before pulverization, at a temperature higher by at least 30° C. than the glass transition temperature and lower by at most 50° C. than the softening point of the borosilicate glass for at least 3 hours in the atmosphere, followed by pulverization.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.