Planar connector
US7789670B2 · kind B2 · utility
31Cited by
1References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2005 |
| Grant date | Sep 7, 2010 |
| Priority date | — |
| Expiry date | Jan 19, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F9/4887
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a very thin planar connector having 2 mm or smaller pitch interval at the lattice area and 0.5 mm or smaller thickness of the lattice area, giving excellent performance in the whole performances such as moldability, flatness, warp-deformation, and heat resistance. A planar connector having a lattice structure within an outer frame is molded by using (C) a resin composition prepared by compounding (A) a liquid-crystalline polymer with (B) a fibrous filler, while the relation between the compounding quantity and the weight-average length of (B) the fibrous filler is controlled to a specified range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.