Pressurized tooling for injection molding and method of using
US7790077B2 · kind B2 · utility
0Cited by
38References
40Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 5, 2007 |
| Grant date | Sep 7, 2010 |
| Priority date | — |
| Expiry date | Aug 20, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2105/253
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention relates to an apparatus and process for injection molding polymer articles that reduces deposition of additives on the apparatus. Specifically, pressurizing of the mold cavity with a pressurized gas reduces the deposition of low molecular weight additives on the apparatus. Embodiments of the invention also include an apparatus for injection molding polymer articles comprising at least one pressurized gas inlet for introducing a pressurized gas into the mold cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.