Injection molding process, apparatus and material for forming cured-in-place gaskets
US7790094B2 · kind B2 · utility
9Cited by
7References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2006 |
| Grant date | Sep 7, 2010 |
| Priority date | — |
| Expiry date | Jul 9, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K2200/0625
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a process for forming a cured-in-place gasket by liquid injection molding. More particularly, the present invention relates to a low pressure and room temperature process for forming a cured-in-place gasket by liquid injection molding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.