Low dielectric constant materials prepared from soluble fullerene clusters
US7790234B2 · kind B2 · utility
5Cited by
43References
19Claims
0Family size
Inventor
Key dates
| Filing date | May 31, 2007 |
| Grant date | Sep 7, 2010 |
| Priority date | — |
| Expiry date | Nov 11, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249953
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This disclosure relates generally to polymeric networks of fullerene compounds, to methods of preparing precursors for such networks, and to their subsequent use as low dielectric constant materials in microelectronic devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.