Dielectric ceramic composition, ceramic substrate, and method for producing the same
US7790271B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 16, 2008 |
| Grant date | Sep 7, 2010 |
| Priority date | — |
| Expiry date | Oct 22, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24999
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A dielectric ceramic composition includes about 10% to about 40% by weight of BaO, about 20% to about 65% by weight of SiO2, about 6% to about 40% by weight of Al2O3, about 1% to about 15% by weight of B2O3, about 0.3% to about 3% by weight of Cr2O3, and about 1% to about 40% by weight of ZrO2. A multilayer ceramic substrate has a laminated structure including an inner layer portion and outer layer portions that have a smaller thermal expansion coefficient than that of the inner layer portion. The use of the dielectric ceramic composition for the outer layer portions enables the ceramic to be resistant to erosion caused by a plating liquid used for plating external conductive films, thus maintaining good adhesiveness between the external conductive films and the outer layer portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.