Probe for high frequency signal transmission and probe card using the same
US7791359B2 · kind B2 · utility
5Cited by
8References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 8, 2008 |
| Grant date | Sep 7, 2010 |
| Priority date | — |
| Expiry date | Aug 20, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/06772
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A probe for high frequency signal transmission includes a metal pin, and a metal line spacedly arranged on and electrically insulated from the metal pin and electrically connected to grounding potential so as to maintain the characteristic impedance of the probe upon transmitting high frequency signal. The maximum diameter of the probe is substantially equal to or smaller than two times of the diameter of the metal pin. Under this circumstance, a big amount of probes can be installed in a probe card for probing a big amount of electronic devices, so that a wafer-level electronic test can be achieved efficiently and rapidly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.