Contour surface cooling of electronics devices
US7791887B2 · kind B2 · utility
10Cited by
16References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 12, 2008 |
| Grant date | Sep 7, 2010 |
| Priority date | — |
| Expiry date | Oct 9, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention provides a cooling device including a heat generating device having a device surface with a device surface contour on at least a portion of the device surface and a base having a base surface with a base surface contour on at least a portion of the base surface. The device surface contour and the base surface contour are substantially similar such that at least a portion of the device surface and the base surface fit in close proximity to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.