Redundant power beneath circuit board
US7791889B2 · kind B2 · utility
103Cited by
15References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 16, 2005 |
| Grant date | Sep 7, 2010 |
| Priority date | — |
| Expiry date | Oct 5, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10689
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB. The second PCB has at least two processors and is coupled to and disposed on a first side of the first PCB. A thermal dissipation device dissipates heat away from the processors. First and second power modules are coupled to and disposed on a second side of the first PCB, the first and second power modules providing redundant power to the two processors on the second PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.