Ultrasonic bonding equipment and resulting bonding structure
US7793815B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2006 |
| Grant date | Sep 14, 2010 |
| Priority date | — |
| Expiry date | Apr 23, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3468
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The disclosure is directed to ultrasonic bonding equipment, in which the anvil and horn include protrusions of varying height to grip the material being bonded. The outer protrusions may form smaller or differently shaped indentations in the material to reduce material stresses of the material at the outer region of the material. An exemplary embodiment of an ultrasonic bonding system includes an anvil and a horn arranged facing the anvil to ultrasonically bond a gripped portion of two or more layers of material. The gripped portion of the layers includes an inner region and an outer region. The anvil and the horn apply a gripping force to the outer region that is less than a gripping force applied to the inner region of the gripped materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.