Thermal and coductivity sensing systems, devices and methods
US7794141B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2007 |
| Grant date | Sep 14, 2010 |
| Priority date | — |
| Expiry date | Apr 21, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02A90/10
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A sensing probe is described. The sensing probe includes a probe housing having a probe tip. A thermal sensor in the housing is also included. The thermal sensor has a sensing end and a connector end, where the sensing end is thermally coupled to the probe tip. Also included are at least two leads. The leads transfer electrical signals that are used to determine temperature and conductivity. Also included is a thermal well. The thermal well includes a hollow housing of a thermally conductive material. The housing has an outer surface and an inner surface. The inner surface is a predetermined shape so as to form a mating relationship with a sensing probe. The mating thermally couples the inner surface with a sensing probe. In some embodiments, the thermal well is located on a disposable portion and the sensing probe on a reusable portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.