Mold, pattern forming method, and pattern forming apparatus
US7794222B2 · kind B2 · utility
14Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2006 |
| Grant date | Sep 14, 2010 |
| Priority date | — |
| Expiry date | Dec 23, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F9/7076
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A mold applicable to imprinting includes a first surface having an area of a pattern to be transferred, a second surface located opposite from the first surface, a first mark for alignment provided at the first surface, and a second mark for alignment provided at a position at which the second mark is spaced from the first surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.