Land grid array (LGA) socket for various package sizes
US7794236B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2008 |
| Grant date | Sep 14, 2010 |
| Priority date | — |
| Expiry date | Dec 15, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49204
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An LGA socket for receiving substrate packages of various sizes and a method of fabricating the socket. In an embodiment, the socket has a planar surface for seating a substrate package. Socket contacts are disposed on the planar surface in a layout common to the layout of interconnects formed on the bottom of substrate packages the socket is designed to receive. A plurality of socket locating features is formed on the socket body to prevent lateral displacement of a reference substrate package. A corresponding number of package locating features are formed on the substrate body of packages larger than the reference substrate package. Each of the socket locating features meshes with the corresponding package locating feature of the larger package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.