Chip-shaped electronic component
US7794628B2 · kind B2 · utility
1Cited by
0References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2006 |
| Grant date | Sep 14, 2010 |
| Priority date | — |
| Expiry date | Apr 23, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01C17/283
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A chip-shaped electronic component includes a substrate and an end face electrode layer provided on an end face of the substrate, in which the end face electrode layer contains a mixed material. The mixed material includes as a conductive particle, a carbon powder, a whisker-like inorganic filler coated with a conductive film, and a flake-like conductive powder. Additionally, an epoxy resin has a weight-average molecular weight between 1,000 and 80,000.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.