Method for manufacturing mold used in impression process
US7794646B2 · kind B2 · utility
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4References
19Claims
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Key dates
| Filing date | Oct 30, 2008 |
| Grant date | Sep 14, 2010 |
| Priority date | — |
| Expiry date | Dec 18, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB82Y40/00
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for manufacturing a mold used in impression process is provided. The method includes the following steps: forming a negative photoresist layer between a transparent substrate and a supporting substrate; exposing the negative photoresist layer via the transparent substrate by direct writing technology; removing the supporting substrate; and developing the negative photoresist layer to form the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.