Printed circuit board and fabricating method of the same
US7794820B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2007 |
| Grant date | Sep 14, 2010 |
| Priority date | — |
| Expiry date | Mar 12, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed herein are a printed circuit board and a fabrication method thereof, which can improve electrical properties, shorten processing time, and reduce the thickness of a chip package by achieving an ultra-thin fine circuit pattern. The printed circuit board includes an insulating material; a via-hole formed in a given location of the insulating material; a copper seed layer formed through ion beam surface treatment and vacuum deposition on the surface of the insulating material having the via-hole formed therein; and a copper pattern plating layer formed on a given region of the insulating material, which has the copper seed layer formed thereon, and in the via-hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.