Flip chip type LED lighting device manufacturing method
US7795626B2 · kind B2 · utility
4Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2007 |
| Grant date | Sep 14, 2010 |
| Priority date | — |
| Expiry date | Nov 7, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8506
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flip chip type LED lighting device manufacturing method includes the step of providing a strip, the step of providing a submount, the step of forming a metal bonding layer on the strip or submount, the step of bonding the submount to the strip, and the step of cutting the structure thus obtained into individual flip chip type LED lighting devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.