Flat substrate having an electrically conductive structure
US7795693B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2006 |
| Grant date | Sep 14, 2010 |
| Priority date | — |
| Expiry date | Mar 6, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10151
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The description is of a flat substrate with an electrically conductive structure integrated inside the flat substrate or applied to a surface of the flat substrate and/or with a technically improved surface.The invention is characterised in that at least one sensor is integrated inside the flat substrate or applied to a surface of the flat substrate, which generates sensor signals according to deformations occurring inside the flat substrate, at least one actuator is integrated inside the flat substrate or applied to the surface of the flat substrate, which enables the flat substrate to mechanically deform when activated, and a signal unit connected to the at least one sensor and to the at least one actuator is provided, which, on the basis of the sensor signals, generates actuator signals for activating the actuator, so that deformations occurring inside the flat substrate are reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.