Two step molding process secured digital card manufacturing method and apparatus
US7795714B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 3, 2007 |
| Grant date | Sep 14, 2010 |
| Priority date | — |
| Expiry date | Jan 25, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A molded secured digital (SD) card having a bottom plastic piece having a plurality of lateral sides, said bottom plastic piece further having a cavity interposed along said plurality of lateral sides, in accordance with an embodiment of the present invention. The molded SD card further having a printed circuit board (PCB) assembly positioned in said cavity, one of said plurality of lateral sides of said bottom plastic piece having a notch recess, said molded SD card further having a male guide insertably positioned into said notch recess, said molded SD card further having a female switch clamped onto said male guide to form a write-protect switch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.