Liquid cooled power electronic circuit comprising a stacked array of directly cooled semiconductor chips
US7795726B2 · kind B2 · utility
16Cited by
5References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 3, 2007 |
| Grant date | Sep 14, 2010 |
| Priority date | — |
| Expiry date | Dec 9, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10158
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A stacked array of channeled semiconductor chips defining a power electronic circuit is mounted in a sealed container provided with inlet and outlet passages for liquid coolant. Leadframe terminals supported by the container engage selected terminals of the semiconductor chips and form leads for mounting the container on a circuit board having electrical and fluid interconnects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.