Hybrid imager
US7796174B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2007 |
| Grant date | Sep 14, 2010 |
| Priority date | — |
| Expiry date | Nov 22, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/184
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to imaging systems that generally include at least a first substrate, on which a charge coupled device imaging sensor array is formed, and a second substrate on which readout circuitry is formed. Information related to the amount of light incident on pixels included in the imaging sensor array is passed to the readout circuitry as a voltage signal over an interconnection between the imaging sensor array and the readout circuitry. Accordingly, the readout circuitry may sample the output of the imaging sensor array multiple times. The system allows different processes to be used for forming the imaging sensor array and the readout circuitry, while also supporting multiple samples of information provided by the imaging sensor array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.