Computer enclosure with heat dissipating assembly
US7796385B2 · kind B2 · utility
3Cited by
11References
16Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Dec 22, 2008 |
| Grant date | Sep 14, 2010 |
| Priority date | — |
| Expiry date | Jan 25, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
A computer enclosure includes a chassis, a heat dissipation fan, a first duct, and a second duct. The chassis includes a bottom panel with a heat generating component and a side panel a vent defined therein. The first duct is attached between a first side of the fan and the vent of the chassis. The second duct is attached to a second side of the fan and covers the heat generating component. The second duct includes a resilient latch structure latchably secured to the second side of the fan.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.