Heat dissipation apparatus having a fan received therein
US7796387B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 9, 2008 |
| Grant date | Sep 14, 2010 |
| Priority date | — |
| Expiry date | Dec 9, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation apparatus includes a heat sink and a fan. The heat sink defines a recessed space at a center of a top end thereof, and an engaging groove in an inner circumference of the top end of the heat sink surrounding and communicating with the space. The fan includes a frame and an impeller assembled to the frame. A plurality of legs extends downwardly from the frame. Each of the legs includes a hook at a free end thereof. The hooks of the legs engage in the engaging groove of the heat sink for securely mounting the fan in the recessed space of the heat sink. Heat pipes extend through the heat sink and connect with a base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.