Patent · US Active

Memory dies for flexible use and method for configuring memory dies

US7796446B2 · kind B2 · utility

31Cited by

3References

19Claims

0Family size

Assignee

Qimonda AG · DE

Inventors

Hermann Ruckerbauer · Radolfzell, DE
Michael Bruennert · Munich, DE
Ullrich Menczigar · Vaterstetten, DE
Christian Mueller · Wiesbaden, DE
Sitt Tontisirin · Bangkok, TH
Georg Braun · Hersbruck, DE
Dominique Savignac · Ismaning, DE

Key dates

Filing date	Sep 19, 2008
Grant date	Sep 14, 2010
Priority date	—
Expiry date	Mar 3, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/16145
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A memory die, including a memory array, a memory array data terminal and a data bus that includes a first sub bus and a second sub bus is disclosed. A first bi-directional buffer arranged between the memory array data terminal and the first sub bus and a second bi-directional buffer arranged between the memory array data terminal and the second sub bus is also disclosed. The first and second bi-directional buffers are adapted to couple the first sub bus or the second sub bus to the memory array data terminal at a time.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.