Thermal management system and associated method
US7797808B2 · kind B2 · utility
10Cited by
9References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 11, 2005 |
| Grant date | Sep 21, 2010 |
| Priority date | — |
| Expiry date | Mar 18, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/269
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for making a thermal interface structure is provided. The method may include disposing a thermal transport layer on a resin layer to form a stacked structure, and slicing the stacked structure to form a cross-sectional slice having a first exposed portion of the thermal transport layer on a first surface of the slice, and a second exposed portion of the thermal transport layer on the second surface of the slice.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.