High density component assembly method and apparatus
US7797823B2 · kind B2 · utility
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16Claims
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Key dates
| Filing date | Dec 31, 2007 |
| Grant date | Sep 21, 2010 |
| Priority date | — |
| Expiry date | Jun 25, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Apparatus and method for providing high density component assemblies, such as electromechanical or electro-optical assemblies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.