Modular enclosure
US7797885B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2005 |
| Grant date | Sep 21, 2010 |
| Priority date | — |
| Expiry date | May 23, 2027 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE04B1/34317
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A modular enclosure may include a number of interlocking components, such as panels, that may be interconnected to form sidewalls, roof and/or floor. The panels may be constructed from blow-molded plastic and a first pattern may be disposed on one surface and a second pattern may be disposed on an opposing surface. One or more points of intersection may be located where the first pattern and the second pattern overlie, and a depression may be disposed at the points of intersection. The depressions are preferably sized and configured to increase the strength and/or rigidity of the panel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.