Method for the treating films
US7799254B2 · kind B2 · utility
14Cited by
23References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2001 |
| Grant date | Sep 21, 2010 |
| Priority date | — |
| Expiry date | Nov 20, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/15
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for treating a film by providing a structure including a substrate and an array of upstanding projections each of which includes multiple contact points. The structure is pressed against the surface of a polymeric film to cause deformation or rupture of the film. The film may then be pressed to partially reseal the perforations. The structure can be produced by electroplating a mould which includes an array of elements of dimensions corresponding to the projections of the desired structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.