Sandwiched thermal solution
US7799428B2 · kind B2 · utility
24Cited by
19References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2004 |
| Grant date | Sep 21, 2010 |
| Priority date | — |
| Expiry date | May 3, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A thermal solution for an electronic device, which is positioned between a heat source and an external surface of the electronic device and/or another component of the electronic device, where the thermal solution facilitates heat dissipation from the heat source while shielding the external surface and/or second component from the heat generated by the heat source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.