Printable semiconductor structures and related methods of making and assembling
US7799699B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2006 |
| Grant date | Sep 21, 2010 |
| Priority date | — |
| Expiry date | Mar 16, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.