Rapidly curing formulations including a conductive component
US7799865B2 · kind B2 · utility
2Cited by
10References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 14, 2005 |
| Grant date | Sep 21, 2010 |
| Priority date | — |
| Expiry date | Mar 28, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0224
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A curable composition for forming anisotropically conductive bonds comprising: (i) an amount of first substantially uncured curable component; (ii) conductive particles coated with a substantially uniformly thick coating of the cure product of a second curable component dispersed within the first curable cyanoacrylate component. The composition is suitable for use as an adhesive composition for bonding chips to electronic circuits. Desirably the first component and the second component are both cyanoacrylates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.