Methods and apparatus for conducting heat from an electronic assembly while providing shock protection
US7800065B2 · kind B2 · utility
13Cited by
7References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2008 |
| Grant date | Sep 21, 2010 |
| Priority date | — |
| Expiry date | Dec 18, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldEnvironmental technology
- WIPO sectorChemistry
Abstract
An apparatus is provided that includes an electronic assembly having a panel and a circuit board, a casing surrounding the electronic assembly and at least one isolated member coupled to the casing. The apparatus further includes a shock absorbing material flexibly coupling the electronic assembly directly or indirectly to the at least one isolated member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.