Patent · US Active

Power electronics assembly with cooling element

US7800220B2 · kind B2 · utility

5Cited by

6References

10Claims

0Family size

Assignee

ECPE Engineering Center for Power Electronics GmbH · DE

Inventors

Martin März · Borgo San Lazzaro, DE
Ernst Schimanek · Nürnberg, DE
Dieter Brunner · Gaggenau, DE
Andreas Schletz · Etzenricht, DE

Key dates

Filing date	Feb 9, 2007
Grant date	Sep 21, 2010
Priority date	—
Expiry date	Jun 4, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/351
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention concerns a power electronic arrangement comprising an insulating substrate, a cooling element arranged beneath the insulating substrate and one or more power electronic components disposed on a respective metallization surface of the insulating substrate. Disposed on the surface of the insulating substrate is a metal layer portion which projects beyond the insulating substrate at all sides. The region of the metal layer portion, that projects beyond the insulating substrate, forms a metal flange which borders the insulating substrate. The cooling element, on its side towards the insulating substrate, beneath the insulating substrate, has one or more recesses, whereby a cavity delimited by the insulating substrate and wall surfaces of the one or more recesses is formed beneath the insulating substrate for receiving a liquid cooling agent. The metal flange is further connected to the cooling element.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.