Ball grid array package and substrate within
US7800231B2 · kind B2 · utility
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1References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 16, 2006 |
| Grant date | Sep 21, 2010 |
| Priority date | — |
| Expiry date | Aug 7, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A ball grid array (BGA) package includes a substrate and a chip. A bottom surface of the substrate includes a central area and a marginal area. Several source balls are disposed in the central area. Several ball groups are disposed in the marginal area. Each ball group includes one ground ball and at most three signal balls. The chip is disposed on a top surface of the substrate and electrically connected to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.