Heat-dissipating structure applied to at least one portable electronic device
US7800903B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 30, 2008 |
| Grant date | Sep 21, 2010 |
| Priority date | — |
| Expiry date | Oct 19, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/1632
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A heat-dissipating structure includes a support unit and a fan unit disposed in the receiving space. The support unit has a plane portion, a support portion extending downwards from a front side of the plane portion, and an opening passing through the plane portion. The plane portion has a board body, a concave space formed on the top surface of the plane portion, a non-skid pad detachably received in the concave space, a slender block body disposed on a base of the top surface of the board body, and a slender non-skid body disposed on a base of the bottom surface of the board body. The support portion has a support body, a receiving space formed in its inside, a plurality of slender openings formed on two opposite lateral sides of the support body, and a slender non-skid body disposed on a base of the support body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.