Patent · US Expired

Device with a heat source formed by a function element that is to be cooled, at least one heat sink, and at least one intermediate layer located between the heat source and the heat sink

US7800908B2 · kind B2 · utility

13Cited by

17References

41Claims

0Family size

Assignees

Curamik Electronics GmbH · DE
Electrovac AG · AT

Inventors

Jurgen Schulz-Harder · Achern, DE
Ernst Hammel · Wien, AT

Key dates

Filing date	Jun 2, 2004
Grant date	Sep 21, 2010
Priority date	—
Expiry date	May 12, 2026

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/30
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention relates to a novel device made up of a heat source that is formed by at least one electrical or electronic component or is provided with such a component, a heat sink, and an intermediate layer which is located between the heat source and the heat sink and is made of a thermally conducting material. The thermally conducting material is made up of an organic matrix with incorporated nanofibers.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.