Electronic component with heat transfer by boiling and condensation and method for producing same
US7802437B2 · kind B2 · utility
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6Claims
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Key dates
| Filing date | Jul 13, 2007 |
| Grant date | Sep 28, 2010 |
| Priority date | — |
| Expiry date | Aug 1, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T436/114998
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The electronic component with heat transfer by boiling and condensation comprises heat exchange surfaces immersed in a heat conducting fluid constituted by the free ends of nanowires of a thermoelectric converter. An electrically insulating coating material with a low thermal conduction partially covers the nanowires above the heat conducting fluid. Each nanowire forms a thermocouple composed of two coaxial branches made from materials of different natures separated by a layer of electrically insulating material and electrically connected individually to the free end of the nanowire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.