Apparatus and method for splicing an elongate multi-layered workpiece
US7803242B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2007 |
| Grant date | Sep 28, 2010 |
| Priority date | — |
| Expiry date | Jan 28, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/12
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
An apparatus for splicing an elongate multi-layered workpiece includes: (a) drives and guides cooperating to drive the workpiece along a working path; (b) a cutter for severing the workpiece; (c) a layer manipulator for separating layers; (d) an applicator for applying adhesive; and (e) a deflector unit for deflecting the workpiece from the working path. The cutter effects the severing to present first and second workpiece segments. The layer manipulator effects inter-layer separation in one segment to present an interlayer zone in the one segment. A drive inserts the other segment in the interlayer zone. The layer manipulator urges the layers together to capture the other segment within the interlayer zone to establish a multi-layer structure. A drive and at least one of the workpiece deflector unit and the applicator situate the multi-layer structure adjacent to the applicator for finishing the splicing by applying adhesive to the multi-layer structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.