Laser device for drilling holes in components of a fluid injection device
US7804041B2 · kind B2 · utility
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36References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2004 |
| Grant date | Sep 28, 2010 |
| Priority date | — |
| Expiry date | Aug 8, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/389
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The laser machining device is provided for drilling holes in components of a fluid injection device, particularly for injecting fuel into a combustion engine. The laser resonator is formed by an optically pumped diode laser solid state active medium. The resonator is arranged for supplying primary pulses in the microsecond range. Modulation means are arranged between the resonator and a machining head for modulating the amplitude of the primary pulses supplied by the resonator, so as to obtain a secondary pulse train of smaller length for each of said pulses.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.