System for interconnecting two substrates each comprising at least one transmission line
US7804695B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2009 |
| Grant date | Sep 28, 2010 |
| Priority date | — |
| Expiry date | Feb 9, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09854
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to an interconnection system of a first substrate (1) comprising at least one first transmission line (3) with a second substrate (10) comprising at least one second transmission line (11), the orientation of the first substrate with respect to the second substrate being arbitrary. The first substrate (1) comprises at least one metallized hole at one extremity of said first line and the second substrate (10) comprises a projecting element extending said second line and a ground saving, said projecting element being inserted into the metallized hole. The invention notably applies in the domain of microwaves and can interconnect a substrate comprising a printed antenna with a substrate receiving the processing circuits of the signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.