Transfer apparatus for transferring a component of integrated circuitry

US7805832B2 · kind B2 · utility

Assignee

• Silverbrook Research Pty Ltd · AU

Inventors

• David Burke · Chatswood, AU
• Jan Waszczuk · Sydney, AU
• Desmond Bruce Boyton · Sydney, AU
• Craig Donald Strudwicke · Sydney, AU
• Peter John Morley Sobey · Sydney, AU
• William Granger · Sydney, AU
• Jason Mark Thelander · Chatswood, AU
• Eric Patrick O'Donnell · Sydney, AU

Key dates

• Filing date: Aug 19, 2008
• Grant date: Oct 5, 2010
• Expiry date: Sep 8, 2028

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/53261
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The invention provides for a transfer apparatus for transferring a component of integrated circuitry from a receiving location to a delivery location within an integrated circuitry assembly machine. The transfer apparatus includes a support structure that defines a transfer path between said locations, and a component carrier that defines a receiving zone configured to receive the component of integrated circuitry. The transfer apparatus also includes a retaining mechanism arranged on the component carrier to retain the component of integrated circuitry in position in the receiving zone, the retaining mechanism being operable to release the component at the delivery location, as well as a displacement mechanism engaged with the component carrier to displace the component carrier along said transfer path.